Reduce manual handling, shorten cycle times

Precise positioning of semiconductor components and optimization of miniature lifting units in chip production.

The WS/WE 2 through-beam photoelectric switch checks the height of chip tableaux.

The C4000 safety light grid safeguards a wire-bonding machine.

The W4-2 photoelectric proximity switch is used here for detecting chips.

Thanks to its particularly small design the MZN1 cylinder sensor can also be mounted on especially short pneumatic cylinders.